LPC55S66JBD100E

NXP USA Inc.

Product No:

LPC55S66JBD100E

Manufacturer:

Package:

100-HLQFP (14x14)

Datasheet:

Description:

HIGH EFFICIENCY ARM CORTEX -M33

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Core Processor	ARM® Cortex®-M33
Speed	150MHz
Operating Temperature	-40°C ~ 105°C (TA)
Program Memory Type	FLASH
RAM Size	144K x 8
Number of I/O	64
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Mounting Type	Surface Mount
Product Status	Active
Oscillator Type	Internal
Supplier Device Package	100-HLQFP (14x14)
EEPROM Size	-
Series	LPC55S6x
Package / Case	100-LQFP Exposed Pad
Core Size	32-Bit
Mfr	NXP USA Inc.
Connectivity	Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Program Memory Size	256KB (256K x 8)
Data Converters	A/D 10x16b SAR
Package	Tray
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V